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HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
1. PART NO. EXPRESSION :
L810HW-1R0MF
(a) (b) (c) (d)(e)
(a) Series code (b) Type code (c) Inductance code : 1R0 = 1.0uH
(d) Tolerance code : M = 20% (e) F : Lead Free
2. CONFIGURATION & DIMENSIONS :
A' A
C' C D L G
SWORLD R47
B
B'
E
PCB Pattern Unit:m/m A' 13.9 Max. A 12.70.3 B' 13.5 Max. B 12.70.3 C' 3.7 Max. C 3.5 Max. D 2.50.5 E 3.00.5 G 7.0 Ref. H 4.5 Ref. L 15.0 Ref.
3. SCHEMATIC :
4. MATERIALS : a b (a) Core (b) Wire (c) Terminal
c
5. FEATURES : a) Shielded Construction b) Frequency up to 5MHz
NOTE : Specifications subject to change without notice. Please check our website for latest information.
H
11.11.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
6. GENERAL SPECIFICATION : a) Test Freq. : Q : 100KHz/1.0VDC b) Ambient Temp. : 20C c) Operating Temp. : -55C to +125C d) Storage Temp. : -55C to +125C e) Humidity Range : 50 ~ 60% RH f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately T=40C without core loss. g) Saturation Current (Isat) : Will cause L 0 to drop approximately 20% typ. h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125C under worst case operating conditions.
7. ELECTRICAL CHARACTERISTICS : Part No. L810HW-R47MF L810HW-R68MF L810HW-R82MF L810HW-1R0MF L810HW-1R5MF L810HW-2R2MF L810HW-3R3MF L810HW-4R7MF L810HW-6R8MF L810HW-100MF Inductance L 0 ( H ) 20% @ 0 Adc 0.47 0.68 0.82 1.00 1.50 2.20 3.30 4.70 6.80 10.0 Test Frequency ( Hz ) 1.0VDC/100K 1.0VDC/100K 0.25VDC/100K 1.0VDC/100K 1.0VDC/100K 1.0VDC/100K 1.0VDC/100K 1.0VDC/100K 1.0VDC/100K 1.0VDC/100K Irms (A) Typ. 32 28 25 24 19 16 12 10 9 7 Isat (A) Typ. 44 40 38 36 28 20 18 16 13 9.5 DCR (m ) Max. 2.0 2.5 3.0 3.5 5.5 8.0 12 15 22 34 Q Min. 12 12 20 20 20 20 20 20 20
NOTE : Specifications subject to change without notice. Please check our website for latest information.
11.11.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
8. CHARACTERISTICS CURVES :
INDUCTANCE VS. FREQUENCY
Q VS. FREQUENCY
INDUCTANCE VS. DC CURRENT
TEMP. RISE VS. DC CURRENT
NOTE : Specifications subject to change without notice. Please check our website for latest information.
11.11.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
8. CHARACTERISTICS CURVES :
L810HW-R47MF SMPI1203HW-R47
0.8 100 90 80
SML810HW-R68MF 8 PI12 03H W-R6
1.5 100 90 1.2 80
INDUCTANCE (uH)
INDUCTANCE (uH)
0.6
TEM P. RISE(oC)
60 0.4 50 40 30 0.2 20 10 0 0
0.9
60 50
0.6
40 30
0.3
20 10
0
0
0
8.8
17.6
26.4
35.2
44
0
8.8
17.6
26 .4
35.2
44
DC CURRENT(A)
DC CURR ENT(A)
L810HW-R82MF
1.5
S L810HW-1R0MF MPI1203HW-1R0
100 90 1.2 80
INDUCTANCE (uH)
0.9
60 50
0.6
40 30
0.3
20 10
0
0
0
8
16
24
32
40
DC CURRENT(A)
L810HW-1R5MF SMPI1203HW-1R5
3 100 90 2.4 80
3.2 4
L810HW -2R2MF SMPI1203HW-2R2
100 90 80
INDUCTANCE (uH)
TEM P. RISE(oC)
1.8
60 50
2.4
60 50
1.2
40 30
1.6
40 30
0.6
20 10
0.8
20 10
0
0
0
0
0
5.6
11.2
16.8
22.4
28
0
4
8
12
16
20
24
DC CURRENT(A)
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
TEMP. RISE(oC)
70
INDUCTANCE (uH)
70
TEM P. RISE(oC)
70
T EM P. RISE( oC)
70
70
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
8. CHARACTERISTICS CURVES :
L810HW-3R3MF SMPI1203HW-3R3
6 100 90 4.8 80
6.4 8
L810HW-4R7MF SMPI1203HW-4R7
100 90 80
INDUCTANCE (uH)
INDUCTANCE (uH)
TEM P. RISE(oC)
3.6
60 50
4.8
60 50
2.4
40 30
3.2
40 30
1.2
20 10
1.6
20 10
0
0
0
0
0
4
8
12
16
20
0
4
8
12
16
20
DC CURRENT(A)
DC CURRENT(A)
L810HW-6R8MF SMPI1203HW-6R8
10 100 90 8 80
12 15
SL810HW-100MF MPI1203HW-100
100 90 80
INDUCTANCE (uH)
TEM P. RISE(oC)
6
60 50
9
60 50
4
40 30
6
40 30
2
20 10
3
20 10
0
0
0
0
0
2.6
5.2
7.8
10.4
13
0
2.2
4.4
6.6
8.8
11
DC CURRENT(A)
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
11.11.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
TEM P. RISE(oC)
70
INDUCTANCE (uH)
70
TEM P. RISE(oC)
70
70
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
9. CORE LOSS : 100KHz and 500KHz
40000
material
30000
gauss loss
100 200
100KHz
500KHz
351.7 665.9 1,039 1,471 1,923 2,537 3,148 3,902
266 1,234 2,932 5,195 8,336 12,025 15,715 20,444 25,429 31,002
KW 3 3 K /mm W/
20000
300 400
500KHZ
500 600 700
100KHZ
10000
800
800 1000
0
0
200
400
600
900 1000
gauss
gauss
100KHz
4000
material
3000
gauss loss
300 400 500 600
100KHz
K W/ /3 3 Km Wm
351.7 665.9 1,039 1,471 1,923 2,537 3,148 3,902
2000
1000
700 800 900
400 600 800 1000
0 200
gau ss
gauss
1000
500KHz
40000
30000
K/ / K W 3m W m
3
20000
10000
0
0
200
400
600
800
1000
g au ss gauss
NOTE : Specifications subject to change without notice. Please check our website for latest information.
11.11.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
10. RELIABILITY AND TEST CONDITION :
ITEM
Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms)
PERFORMANCE
Refer to standard electrical characteristics list
TEST CONDITION
HP4284A, CH11025, CH3302, CH1320, CH1320S LCR meter. CH16502, Agilent33420A Micro-Ohm Meter. Irms(A) will cause the coil temperature rise approximately T=40C without core loss 1. Applied the allowed DC current 2. Temperature measured by digital surface thermometer Isat(A) will cause Lo to drop approximately 20%
Saturation Current (Isat) Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder.
Preheating Dipping 245C Natural cooling
Preheat : 150C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 2455C Flux for lead free : rosin Dip Time : 41sec.
150C
60 seconds
41 seconds
Solder Heat Resistance
1. Appearance : No significant abnormality 2. Inductance change : Within 20%
Preheating 260C Dipping Natural cooling
Preheat : 150C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 2605C Flux for lead free : rosin Dip Time : 100.5sec.
150C
60 seconds
100.5 seconds
Reliability Test High Temperature Life Test Low Temperature Life Test Thermal Shock Temperature : 1255C Time : 50012 hours Measure at room temperature after placing for 2 to 3 hrs. 1. Appearance : No damage 2. Inductance : Within 20% of initial value. No disconnection or short circuit. Temperature : -555C Time : 50012 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle.
Step 1 2 3 4 Temperature (C) -553 Room Temperature +1253 Room Temperature Times (min.) 303 Within 3 303 Within 3
Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within 20% of initial value. No disconnection or short circuit. Temperature : 405C Humidity : 90% to 95% Applied Current : Rated Current Time : 50012 hours Measure at room temperature after placing for 2 to 3 hrs. Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours).
Random Vibration Test
Appearance : Cracking, shipping and any other defects harmful to the characteristics should not be allowed.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
11.11.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
11. SOLDERING AND MOUNTING : 11-1. Recommended PC Board Pattern
4.0 7.0 4.0
11-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 11-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 11-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150C. b) 280C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs.
4.5
Preheating TEMPERATURE C
250~260 230 180 150 60~120s
Soldering
TEMPERATURE C
10s max.
Natural cooling
Preheating
280 260 150
Soldering
Natural cooling
30~60s
Over 1min.
Gradual Cooling Within 3secs.
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
11.11.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
12. PACKAGING INFORMATION : 12-1. Reel Dimension
COVER TAPE
2.00.5 D B OC A
EMBOSSED CARRIER
Type 13" x 24mm
A(mm) 24.00.5
B(mm) 1002.0
C(mm) 13.50.5
D(mm) 330
12-2 Tape Dimension
1.750.1
4.00.1
2.00.1
O1.5+0.1
t
F W
0.15 MIN
P Ao
Bo
Ko
Series L810HW
Ao(mm) 13.50.1
Bo(mm) 13.90.1
Ko(mm) 4.50.1
P(mm) 16.00.1
W(mm) 24.00.3
F(mm) 11.50.1
t(mm) 0.350.05
12-3. Packaging Quantity
Size Chip / Reel Inner Box Carton
L810HW 600 1200 4800
NOTE : Specifications subject to change without notice. Please check our website for latest information.
11.11.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
12-4. Tearing Off Force F
165 to 180
The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions.
Room Temp. (C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300
Top cover tape
Base tape
Application Notice
1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
11.11.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 10

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